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XC7K160T-2FFG676I FPGA - Field Programmable Gate Array
FPGA Core & Logic Capacity:
162,240 logic cells (based on 28nm High-Performance Low-Power (HPL) technology).
Part of the Kintex®-7 family, optimized for high-performance, low-power applications.
High-Speed I/O & Interfaces:
400 user I/O pins (supports LVDS, LVCMOS, HSTL, SSTL).
SelectIO™ technology for flexible voltage support (1.2V–3.3V).
8 high-speed transceivers (up to 12.5 Gbps each).
PCI Express® (PCIe) Gen2/3 support.
Memory & Storage:
11.7 Mb (11700 kbit) of Block RAM.
Supports DDR3 memory interfaces (up to 800 Mbps).
DSP & Processing Power:
DSP48E1 slices for high-performance signal processing.
Integrated MicroBlaze™ soft processor for embedded applications.
Clock Management:
Mixed-Mode Clock Managers (MMCMs) and Phase-Locked Loops (PLLs) for precise timing control.
Security & Configuration:
256-bit AES encryption for secure bitstream loading.
Built-in SEU (Single Event Upset) detection and correction for reliability.
Power Efficiency:
0.97V–1.03V core voltage for low-power operation.
Advanced power gating for optimized energy consumption.
Package & Temperature Range:
676-pin FCBGA (Fine-Pitch Ball Grid Array).
Industrial temperature range (-40°C to 100°C).
High-Speed Data Acquisition:
4-channel, 125Msps 16-bit ADCs for real-time signal processing.
PXIe-based test & measurement systems (e.g., 24-bit 16-channel signal acquisition)
Video & Imaging:
CameraLink-to-fiber conversion (1× Full CameraLink → 4× 10G SFP+ fiber)
Medical imaging & industrial vision systems.
Wireless Communications:
4G/5G baseband processing and software-defined radio (SDR).
Radar & electronic warfare (EW) systems.
Networking & Data Acceleration:
PCIe-based accelerators for AI/ML workloads.
High-speed switches & routers.
Industrial Automation:
Motor control & robotics.
Real-time sensor processing.
For detailed specifications, refer to Xilinx DS180 (7 Series FPGAs Overview).
Would you like additional information on development tools (Vivado/ISE) or migration options?
Key Similarities:
Same 676-pin FCBGA package.
Identical 162,240 logic cells, 400 I/Os, and 11.7 Mb block RAM.
Supports PCIe Gen2/3, DDR3, and high-speed transceivers (12.5 Gbps).
Differences:
Temperature Range:
-2FFG676I: -40°C to 100°C (Industrial).
-2FFG676C: 0°C to 85°C (Commercial) .
Key Similarities:
Same Kintex-7 FPGA family and 676-pin package.
Identical logic capacity and I/O count.
Differences:
Speed Grade:
-2FFG676I: Higher performance (-2 speed grade).
-1FFG676I: Lower speed (-1 speed grade) .
Key Similarities:
Same Kintex-7 family and 676-pin FCBGA.
Supports PCIe, DDR3, and high-speed transceivers (12.5 Gbps).
Differences:
Higher Logic Capacity (326,080 logic cells).
More DSP slices and block RAM for complex signal processing
Key Similarities:
Same Kintex-7 architecture and 676-pin FCBGA.
Supports PCIe, DDR3, and high-speed I/O.
Differences:
Higher logic density (406,720 logic cells).
More transceivers (16 vs. 8 in XC7K160T)
Key Similarities:
Same Kintex-7 FPGA family and 676-pin package.
Supports PCIe and DDR3 interfaces.
Differences:
Lower logic capacity (65,600 logic cells).
Fewer transceivers (4 vs. 8 in XC7K160T
Key Features of XC7K160T-2FFG676I:
Typical Applications:
Comparison with Similar Models:
Model
Logic Cells
Transceivers
Temp Range
Key Differences
XC7K160T-2FFG676I
162,240
8 (12.5 Gbps)
-40°C to 100°C
Industrial-grade, high DSP performance
XC7K160T-1FFG676C
162,240
8 (12.5 Gbps)
0°C to 85°C
Commercial-grade, lower speed grade
XC7K325T-2FFG676I
326,080
16 (12.5 Gbps)
-40°C to 100°C
Higher logic density
1. XC7K160T-2FFG676C
2. XC7K160T-1FFG676I
3. XC7K325T-2FFG676I
4. XC7K410T-2FFG676I
5. XC7K70T-2FBG676I
AMD's Acquisition of Xilinx: Key Facts
Announcement & Completion Dates:
Announced: October 27, 2020.
Completed: February 14, 2022
Deal Value & Structure:
$35 billion (all-stock transaction).
Xilinx shareholders received 1.7234 AMD shares per Xilinx share.
Post-acquisition, AMD shareholders owned 74%, and Xilinx shareholders held 26% of the combined company
Leadership & Integration:
Lisa Su (AMD CEO) remained CEO of the merged entity.
Victor Peng (former Xilinx CEO) became president of AMD's Adaptive and Embedded Computing Group (AECG).
Xilinx continued operating as an AMD subsidiary, retaining its FPGA and adaptive computing focus
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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7K160T-2FFG676I we delivered, we will accept the replacement or return of the XC7K160T-2FFG676I only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of XC7K160T-2FFG676I.
(3)The PartNo is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
If you need any after-sales service, please do not hesitate to contact us.
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Part Number | XC7K325T-3FFG676E | XC7K325T-3FFG900E | XC7K325T-L2FFG676E | XC7K325T-L2FFG900E | XC7K480T-1FFG1156C |
Manufacturer | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
Package/Case | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 676-BBGA, FCBGA |
Packaging | Tray | Tray | Tray | Tray | Tray |
Series | Kintex®-7 | Kintex®-7 | Kintex®-7 | Kintex®-7 | Kintex®-7 |
ProductStatus | Active | Active | Active | Active | Active |
NumberofLABs/CLBs | 12675 | 12675 | 12675 | 12675 | 12675 |
NumberofLogicElements/Cells | 162240 | 162240 | 162240 | 162240 | 162240 |
TotalRAMBits | 11980800 | 11980800 | 11980800 | 11980800 | 11980800 |
NumberofI/O | 400 | 400 | 400 | 400 | 400 |
NumberofGates | - | - | - | - | - |
Voltage-Supply | 0.97V ~ 1.03V | 0.97V ~ 1.03V | 0.97V ~ 1.03V | 0.97V ~ 1.03V | 0.97V ~ 1.03V |
MountingType | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
OperatingTemperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
AMD Xilinx
AMD Xilinx
AMD Xilinx
AMD Xilinx
AMD Xilinx
AMD Xilinx
AMD Xilinx
AMD Xilinx
AMD Xilinx
AMD Xilinx