Xilinx Inc. XC6VSX315T-2FFG1156I

XC6VSX315T-2FFG1156I
Part No.:
XC6VSX315T-2FFG1156I
Manufacturer:
Xilinx Inc.
Category:
Embedded - FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
Deyee Tech  LimitedXC6VSX315T-2FFG1156I.pdf
Description:
IC FPGA 600 I/O 1156FCBGA
Quantity:

Unit Price:$0

Ext Price:$0

Product details

  • Details
  • Specifications
  • FAQ
  • Product Comparison
  • Related Categories

XC6VSX315T-2FFG1156I PGA - Field Programmable Gate Array

Key Features of XC6VSX315T-2FFG1156I:

  1. FPGA Core & Logic Capacity:

    • 314,880 logic cells (based on 40nm CMOS technology).

    • Part of the Virtex®-6 SXT family, optimized for high-speed DSP and serial connectivity.

  2. High-Speed Serial Transceivers:

    • Supports up to 6.5 Gbps GTX transceivers (number varies by package).

    • Ideal for PCIe, SATA, Gigabit Ethernet, and high-speed data links.

  3. Memory & Storage:

    • Block RAM: ~12.8 Mb (distributed across multiple 36 Kb blocks).

    • Supports DDR3 memory interfaces (up to 800 Mbps).

  4. I/O & Interfaces:

    • 600 user I/O pins (supports LVDS, LVCMOS, HSTL, SSTL).

    • SelectIO™ technology for flexible voltage support (1.2V–3.3V).

    • PCI Express® (PCIe) Gen1/2/3 endpoint support.

  5. Clock Management:

    • Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs) for precise timing.

  6. Power Efficiency:

    • 1.0V core voltage with advanced power gating for low-power operation.

  7. Package & Temperature Range:

    • 1156-pin FCBGA (Flip-Chip BGA).

    • Industrial temperature range (-40°C to 100°C).


Typical Applications:

  1. Wireless Communications:

    • 4G/5G baseband processing, beamforming, and MIMO systems.

    • Software-defined radio (SDR) and RF signal processing.

  2. Data Center & Networking:

    • High-speed switches, routers, and network accelerators.

    • PCIe-based acceleration cards for AI/ML workloads.

  3. Defense & Aerospace:

    • Radar, sonar, and electronic warfare (EW) systems.

    • Secure communications and real-time signal intelligence (SIGINT).

  4. Medical Imaging:

    • Ultrasound, MRI, and CT scan processing.

    • High-throughput medical data acquisition.

  5. Industrial Automation:

    • Real-time motor control and robotics.

    • High-speed sensor data processing.

  6. Video & Broadcast:

    • Ultra-HD video processing and broadcast equipment.

    • Real-time video transcoding.


Comparison with Similar Models:

Model Logic Cells Transceivers Temp Range Key Differences
XC6VSX315T-2FFG1156I 314,880 Up to 6.5 Gbps -40°C to 100°C Industrial-grade, high-speed DSP
XC6VSX315T-1FFG1156I 314,880 Up to 6.5 Gbps -40°C to 100°C Lower speed grade (-1 vs. -2)
XC6VSX475T-2FFG1759I 475,200 Up to 6.5 Gbps -40°C to 100°C Larger logic capacity, 1759-pin package
XC6VLX365T-2FFG1156I 364,032 Fewer transceivers -40°C to 100°C More logic cells, fewer DSP blocks

For detailed specifications, refer to Xilinx DS150 (Virtex-6 Family Overview)

Here are the similar/replacement models to XC6VSX315T-2FFG1156I, along with their key differences and compatibility:

1. XC6VSX315T-L1FFG1156C

  • Key Similarities:

    • Same 1156-pin FCBGA package.

    • Virtex®-6 SXT FPGA family with 314,880 logic cells.

    • Supports DDR3, PCIe, and high-speed transceivers.

  • Differences:

    • Speed Grade:

      • -2FFG1156I: Higher performance (-2 speed grade).

      • -L1FFG1156C: Lower speed (-1L speed grade) .

    • Temperature Range:

      • -2FFG1156I-40°C to 100°C (Industrial).

      • -L1FFG1156C0°C to 85°C (Commercial) .

2. XC6VSX315T-2FF1156I

  • Key Similarities:

    • Same 314,880 logic cells and 600 I/Os.

    • Compatible Virtex-6 SXT architecture.

  • Differences:

    • Minor electrical characteristics (e.g., power consumption may vary slightly) .

3. XC6VSX475T-2FFG1759C

  • Key Similarities:

    • Same Virtex-6 SXT family and -2 speed grade.

    • Supports similar high-speed interfaces (PCIe, Gigabit Ethernet).

  • Differences:

    • Higher logic capacity (475,200 logic cells).

    • Larger package (1759-pin FCBGA) .

4. XC6VLX365T-2FFG1156I (Virtex-6 LXT Variant)

  • Key Similarities:

    • Same 1156-pin FCBGA package.

    • 364,032 logic cells (slightly higher than XC6VSX315T).

  • Differences:

    • LXT vs. SXT: LXT focuses on logic optimization, while SXT emphasizes DSP and transceiver performance


    • XC6VLX75T 
      XC6VLX130T
      XC6VLX195T
      XC6VLX240T 
      XC6VLX365T
      XC6VLX550T 
      XC6VLX760T 
      XC6VSX315T
      XC6VSX475T 
      XC6VHX250T
      XC6VHX255T 
      XC6VHX380T
      XC6VHX565T

General Description

Virtex®-6 FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated 

software and hardwarecomponents to enable designers to focus on innovation as soon as their development cycle begins. 

Using the third-generation ASMBL™(Advanced Silicon Modular Block) column-based architecture, 

the Virtex-6 family contains multiple distinct sub-families. This overviewcovers the devices in the LXT, SXT, 

and HXT sub-families. Each sub-family contains a different ratio of features to most efficiently addressthe 

needs of a wide variety of advanced logic designs. In addition to the high-performance logic fabric, 

Virtex-6 FPGAs contain many builtin system-level blocks. 

These features allow logic designers to build the highest levels of performance and functionality into their FPGAbased systems. 

Built on a 40 nm state-of-the-art copper process technology, Virtex-6 FPGAs are a programmable alternative to customASIC technology. 

Virtex-6 FPGAs offer the best solution for addressing the needs of high-performance logic designers, 

high-performanceDSP designers, and high-performance embedded systems designers with unprecedented logic, DSP, 

connectivity, and softmicroprocessor capabilities.


Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Series:
Virtex®-6 SXT
ProductStatus:
Active
NumberofLABs/CLBs:
24600
NumberofLogicElements/Cells:
314880
TotalRAMBits:
25952256
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.95V ~ 1.05V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)
Category:
Embedded - FPGAs (Field Programmable Gate Array)
Datasheet:
Deyee Tech  LimitedXC6VSX315T-2FFG1156I.pdf

1. How to order XC6VSX315T-2FFG1156I on Deyee Tech Limited?

Currently, Deyee Tech Limited only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

2. How does Deyee Tech Limited guarantee that XC6VSX315T-2FFG1156I is from the original manufacturer or authorized agents?

We have a professional and experienced quality control team to strictly verify and test the XC6VSX315T-2FFG1156I. All suppliers must pass our qualification reviews before they can publish their products including XC6VSX315T-2FFG1156I on Deyee Tech Limited; we pay more attention to the channels and quality of XC6VSX315T-2FFG1156I products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the XC6VSX315T-2FFG1156I price and inventory displayed accurate?

The price and inventory of XC6VSX315T-2FFG1156I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XC6VSX315T-2FFG1156I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC6VSX315T-2FFG1156I we delivered, we will accept the replacement or return of the XC6VSX315T-2FFG1156I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC6VSX315T-2FFG1156I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as XC6VSX315T-2FFG1156I pin diagram, XC6VSX315T-2FFG1156I datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Image XC6VSX315T-1FFG1156C XC6VSX315T-1FFG1759C XC6VSX315T-2FFG1156C XC6VSX315T-1FF1759C XC6VSX315T-1FFG1156I
Part Number XC6VSX315T-1FFG1156C XC6VSX315T-1FFG1759C XC6VSX315T-2FFG1156C XC6VSX315T-1FF1759C XC6VSX315T-1FFG1156I
Manufacturer AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx Xilinx Inc.
Package/Case 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA 1156-BBGA, FCBGA
Packaging Tray Tray Tray Tray Tray
Series Virtex®-6 SXT Virtex®-6 SXT Virtex®-6 SXT Virtex®-6 SXT Virtex®-6 SXT
ProductStatus Active Active Active Active Active
NumberofLABs/CLBs 24600 24600 24600 24600 24600
NumberofLogicElements/Cells 314880 314880 314880 314880 314880
TotalRAMBits 25952256 25952256 25952256 25952256 25952256
NumberofI/O 600 600 600 600 600
NumberofGates - - - - -
Voltage-Supply 0.95V ~ 1.05V 0.95V ~ 1.05V 0.95V ~ 1.05V 0.95V ~ 1.05V 0.95V ~ 1.05V
MountingType Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)

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