H5TQ2G63FFR-PBC Functional Description and Applications

Functional Overview

The H5TQ2G63FFR-PBC is a 2 Gb (Gigabit) DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random Access Memory) manufactured by SK hynix. 

Designed for high-speed data processing and low-power consumption, 

this memory chip features a compact package and advanced architecture to support modern computing systems. 

Key functional features include:

• High Capacity & Density: 2 Gb (256 MB × 8-bit) configuration, suitable for multi-channel memory systems in laptops, desktops, and servers.
• DDR3 Technology: Operates at data transfer rates up to 1600 MT/s (Megatransfers per second), enabling double-data-rate operation on both rising and falling clock edges.
• Low Power Consumption: 1.5 V nominal operating voltage with power-saving modes (self-refresh, precharge power-down), ideal for portable and energy-efficient devices.
• Enhanced Data Integrity: On-die parity check and error correction support (for specific applications), reducing data corruption in high-reliability systems.
• FBGA Package: 96-ball FBGA (Fine-Pitch Ball Grid Array) package with lead-free construction, ensuring compactness and high thermal performance.
• Synchronous Operation: Fully synchronous interface with command/address registers, enabling precise timing control in complex memory architectures.

Key Applications

1. Computer & Server Memory
   • Main system memory (RAM) in laptops, desktops, and workstations (e.g., 4GB–16GB memory modules).
   • High-density memory banks in server racks for cloud computing and data centers.
2. Consumer Electronics
   • Smart TVs and set-top boxes for video processing and multi-tasking.
   • Gaming consoles (e.g., PlayStation, Xbox) for high-speed game data loading.
   • Digital cameras and camcorders for buffer storage during high-resolution image capture.
3. Industrial & Embedded Systems
   • Industrial control panels and human-machine interfaces (HMIs) requiring fast data processing.
   • Medical devices (MRI, ultrasound machines) for real-time image rendering.
   • Automotive infotainment systems and advanced driver-assistance systems (ADAS).
4. Networking & Communications
   • Network routers and switches for packet buffering in high-speed data networks.
   • Telecom base stations and satellite communication equipment for signal processing.
5. Storage & Computing Peripherals
   • Solid-state drives (SSDs) with DRAM cache for improved read/write speeds.
   • External memory modules for digital signage and interactive kiosks.

Application Circuit Example

CPU (e.g., Intel Core i5) --+                                    +--+
                          |                                    |  |
                          ↓                                    ↓  |
                    Memory Controller                          |  |
                          |                                    |  |
                          +--------+--------+--------+--------+--+
                                   |        |        |        |
                                   ↓        ↓        ↓        ↓
                      +---------+---------+---------+---------+
                      | H5TQ2G63 | H5TQ2G63 | H5TQ2G63 | H5TQ2G63 |
                      | FFR-PBC | FFR-PBC | FFR-PBC | FFR-PBC |
                      +---------+---------+---------+---------+
                                   |        |        |        |
                                   ↑        ↑        ↑        ↑
                          +--------+--------+--------+--------+
                          |                                    |
                          |       DDR3 Memory Bus (1.5 V)     |
                          |  (CLK, DQS, DQ, CA, VDD, VSS, etc.)|
                          |                                    |
                          +------------------------------------+ 

Technical Specifications Summary

Design Considerations

• Signal Integrity: Route address/command (CA) signals and data (DQ/DQS) lines with controlled impedance (50–75 Ω) and minimal skew for high-speed operation.
• Power Supply Filtering: Use low-ESR capacitors (10 μF–100 μF) near the VDD pins to suppress voltage ripple and noise.
• Thermal Management: Ensure adequate airflow or heat sinking in high-duty-cycle applications; FBGA package allows efficient heat dissipation.
• Clock & Timing: Use a dedicated clock generator with low jitter for the DDR3 interface, and implement termination resistors (ODT) for signal stability.
• Memory Controller Configuration: Set CAS latency (CL), tRCD, tRP, and other timing parameters according to the datasheet (e.g., CL=9–11 at 1600 MT/s).

The following parts are popular search parts in Memory - Controllers.

The following parts include "H5TQ2G63FFR-PBC" in ISSI, Integrated Silicon Solution Inc“H5TQ2G63FFR-PBC”.

• Part Number
• Manufacturer
• Package
• Description