MT41J64M16JT-15EITG is a type of DDR3 SDRAM memory chip by Miron

Functions

1. Power Supply: It supports a working voltage of 1.5V (VDD = VDDQ = 1.5V ± 0.075V), which is suitable for low-power design.
2. I/O Interface: Adopts 1.5V center-terminated push/pull I/O to ensure stable signal transmission. It also uses differential bidirectional data strobe, which improves the reliability of data transmission.
3. Architecture Design: With an 8n-bit prefetch architecture, it can accelerate data access speed and reduce latency.
4. Clock Signal: Supports differential input clocks (CK, CK#), providing precise time control.
5. Internal Banks: The memory chip has 8 internal banks, allowing concurrent data read and write operations, which improves the overall system performance.
6. On - Die Termination (ODT): Provides programmable ODT for data, strobe, and mask signals to adapt to different working modes.
7. Programmable Latency: CAS latency (CL), POSTED CAS ADDITIVE latency (AL), and CAS write latency (CWL) can be set according to tCK, with high flexibility.
8. Memory Modes: Supports a fixed burst length of 8 (BL8) and a burst chop of 4 (BC4), which can be dynamically adjusted through the mode register set (MRS). It also allows for on - the - fly selection of BC4 or BL8.
9. Self - Refresh: Has a self - refresh mode. The self - refresh time (TC) is 64ms with 8192 - cycle refresh at 0°C to 85°C, 
10. and 32ms with 8192 - cycle refresh at 85°C to 95°C. It also has temperature - dependent automatic self - refresh (ASR) capability to ensure normal memory operation at different temperatures.
11. Optimization Technologies: Includes write leveling, multipurpose register, and output driver calibration to optimize signal quality and reduce power consumption.

Applications

1. Computers: It can be used in desktop computers, laptops, and servers as system memory to improve the computer's data processing speed and multitasking ability.
2. Consumer Electronics: Such as digital TVs, set - top boxes, and game consoles. In digital TVs, it can be used to cache video data to ensure smooth video playback.
3.  In game consoles, it helps to store game data and improve game loading speed and running performance.
4. Industrial Control: In industrial control systems, it is used to store and process control data, ensuring the stable operation of the system and the timely processing of various control instructions.
5. Communication Equipment: Such as routers, switches, etc. It can be used to buffer and process data packets, improving the data processing and transmission efficiency of communication equipment.

Core Architecture & Key Features

1. Memory Density & Organization
   • Capacity: 1Gb (64M x 16-bit configuration) .
   • Banks: 8 internal banks for parallel data access, enabling concurrent read/write operations .
   • Prefetch Architecture: 8n-bit prefetch design, doubling data throughput compared to DDR2. This allows 8 data transfers per clock cycle (2x the rate of DDR2) .
2. Clock & Data Rate
   • Clock Frequency: Supports up to 667 MHz (15ns clock cycle, indicated by the "-15E" suffix) .
   • Data Rate: 1333 MT/s (MT = million transfers per second), achieved via DDR (Double Data Rate) signaling .
3. Timing Parameters
   • CAS Latency (CL): 9-11 cycles at 1333 MT/s (e.g., CL=9 for DDR3-1333) .
   • tRCD (RAS to CAS Delay): 15ns (10 cycles at 667 MHz) .
   • tRP (Precharge Command Delay): 15ns (10 cycles) .
   • tRAS (Active to Precharge Delay): 36ns (24 cycles) .
   • Write Recovery Time (tWR): Configurable via Mode Register (MR0), typically 15ns .
4. Voltage & Power
   • Supply Voltage: 1.5V ±0.075V (standard for DDR3) .
   • Power Modes:
     • Active Current: ~0.42A during high-speed operations .
     • Standby Current: <0.01A in low-power states .
     • Self-Refresh Current: ~1.0mA at 85°C .
5. I/O Interface
   • Differential Clocks (CK/CK#): Ensures stable timing for high-speed data transfers .
   • Bidirectional Data Strobe (DQS): Differential signaling for precise data alignment .
   • On-Die Termination (ODT): Programmable termination (24-75Ω) for data, strobe, and mask signals to reduce signal reflections .
6. Self-Refresh & Temperature Management
   • Self-Refresh Rate: 8192 cycles/64ms at 0°C–85°C, 8192 cycles/32ms at 85°C–95°C .
   • Automatic Self-Refresh (ASR): Adjusts refresh rate based on temperature to optimize power efficiency .
7. Package & Physical Specifications
   • Package: 96-ball FBGA (Fine-Pitch Ball Grid Array), measuring 8mm x 14mm .
   • Pinout: 96 pins, including 16 data lines (DQ0–DQ15), 8 address lines (A0–A12), and control signals (e.g., RAS#, CAS#, WE#) .
   • RoHS Compliance: Lead-free and halogen-free .
8. Advanced Features
   • Write Leveling: Adjusts DQS skew to align data transitions with the clock .
   • Multipurpose Register (MPR): Stores predefined test patterns for diagnostic purposes .
   • ZQ Calibration: Automatically tunes ODT and output driver strength for signal integrity .

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