XC6SLX45-3FGG484C FPGA - Field Programmable Gate Array

Key Features of XC6SLX45-3FGG484C:

1. FPGA Core & Logic Capacity:

   • 43,661 logic cells (43661 LUTs & flip-flops).

   • Spartan-6 LX Family (logic-optimized for cost efficiency).

   • Built on 45nm CMOS technology for low power consumption.

2. Memory & Storage:

   • 2,138,112 bits (267 KB) of block RAM (distributed as 148 × 18 Kb blocks).

   • Supports DDR3 memory interface (up to 800 Mbps).

3. High-Speed I/O & Interfaces:

   • 316 user I/O pins (supports multiple I/O standards like LVCMOS, LVDS, HSTL).

   • SelectIO™ technology for flexible voltage support (1.2V to 3.3V).

   • Gigabit Ethernet MAC (EMAC) for networking applications.

4. Clock Management:

   • Digital Clock Manager (DCM) & Phase-Locked Loops (PLLs) for precise timing control.

5. Power Efficiency:

   • 1.14V to 1.26V core voltage (low-power operation).

   • Zero-power suspend mode for ultra-low standby power.

6. Configuration & Security:

   • Supports AES encryption for secure bitstream loading.

   • Device DNA for unique FPGA identification.

7. Package & Temperature Range:

   • 484-pin FBGA (Fine-Pitch Ball Grid Array).

   • Commercial temperature range (0°C to 85°C).

Typical Applications:

1. Industrial Automation:

   • Motor control, PLCs (Programmable Logic Controllers), and robotics.

   • Real-time sensor data processing.

2. Consumer Electronics:

   • Digital displays, set-top boxes, and multimedia processing.

3. Communications & Networking:

   • Ethernet switches, routers, and protocol bridging.

4. Medical Devices:

   • Portable medical imaging and diagnostic equipment.

5. Automotive (Non-Automotive Grade Variant):

   • Infotainment systems (for non-safety-critical applications).

6. Test & Measurement:

   • High-speed data acquisition systems.

Comparison with Similar Models:

• XC6SLX45-2FGG484C: Same logic capacity but slightly lower speed grade (-2 vs. -3).

• XA6SLX45-3FGG484I: Automotive-grade version with extended temperature range (-40°C to 100°C)6.

For detailed specifications, refer to the Xilinx DS160 Spartan-6 Family Datasheet

Here are the similar/replacement models to XC6SLX45-3FGG484C, along with their key differences and compatibility:

1. XC6SLX45-2FGG484C

• Key Similarities:

  • Same 484-pin FBGA package.

  • Identical 43,661 logic cells and 316 I/Os.

  • Supports DDR3, PCIe, and Gigabit Ethernet.

• Differences:

  • Speed Grade:

    • -3FGG484C: Higher performance (-3 speed grade).

    • -2FGG484C: Slightly lower speed (-2 speed grade) .

2. XA6SLX45-3FGG484I (Automotive Grade)

• Key Similarities:

  • Same logic capacity and I/O count.

  • Compatible Spartan-6 LX architecture.

• Differences:

  • Temperature Range:

    • -3FGG484C: 0°C to 85°C (Commercial).

    • -3FGG484I: -40°C to 100°C (Automotive, AEC-Q100 qualified) 9.

3. XC6SLX45-2FG484C

• Key Similarities:

  • Same 43661 logic cells and 316 I/Os.

  • Compatible Spartan-6 LX FPGA family.

• Differences:

  • Package:

    • -3FGG484C: 484-FBGA (Fine-Pitch BGA).

    • -2FG484C: Standard 484-BGA (minor mechanical differences) .

4. XA6SLX45-2FGG484Q

• Key Similarities:

  • Same 45nm CMOS technology and 1.2V core voltage.

• Differences:

  • Extended industrial temperature range (-40°C to 100°C).

  • Higher reliability for harsh environments .

Comparison Summary

For detailed datasheets, refer to Xilinx DS160 (Spartan-6 Family Overview) .

Summary of Spartan-6 FPGA Features

• Spartan-6 Family:

• Spartan-6 LX FPGA: Logic optimized

• Spartan-6 LXT FPGA: High-speed serial connectivity

• Designed for low cost

• Multiple efficient integrated blocks

• Optimized selection of I/O standards

• Staggered pads• High-volume plastic wire-bonded packages

• Low static and dynamic power• 45 nm process optimized for cost and low power

• Hibernate power-down mode for zero power

• Suspend mode maintains state and configuration withmulti-pin wake-up, control enhancement

• Lower-power 1.0V core voltage (LX FPGAs, -1L only)

• High performance 1.2V core voltage (LX and LXTFPGAs, -2, -3, and -3N speed grades)

• Multi-voltage, multi-standard SelectIO™ interface banks

• Up to 1,080 Mb/s data transfer rate per differential I/O

• Selectable output drive, up to 24 mA per pin

• 3.3V to 1.2V I/O standards and protocols

• Low-cost HSTL and SSTL memory interfaces

• Hot swap compliance

• Adjustable I/O slew rates to improve signal integrity

• High-speed GTP serial transceivers in the LXT FPGAs

• Up to 3.2 Gb/s• High-speed interfaces including: Serial ATA, Aurora,1G Ethernet, PCI Express, OBSAI, CPRI, EPON,GPON, DisplayPort, and XAUI

• Integrated Endpoint block for PCI Express designs (LXT)

• Low-cost PCI® technology support compatible with the33 MHz, 32- and 64-bit specification.

• Efficient DSP48A1 slices

• High-performance arithmetic and signal processing

• Fast 18 x 18 multiplier and 48-bit accumulator

• Pipelining and cascading capability

• Pre-adder to assist filter applications

Integrated Memory Controller blocks

• DDR, DDR2, DDR3, and LPDDR support

• Data rates up to 800 Mb/s (12.8 Gb/s peak bandwidth)

• Multi-port bus structure with independent FIFO to reducedesign timing issues

• Abundant logic resources with increased logic capacity

• Optional shift register or distributed RAM support

• Efficient 6-input LUTs improve performance andminimize power

• LUT with dual flip-flops for pipeline centric applications

• Block RAM with a wide range of granularity• Fast block RAM with byte write enable

• 18 Kb blocks that can be optionally programmed as twoindependent 9 Kb block RAMs

• Clock Management Tile (CMT) for enhanced performance

• Low noise, flexible clocking• Digital Clock Managers (DCMs) eliminate clock skewand duty cycle distortion

• Phase-Locked Loops (PLLs) for low-jitter clocking

• Frequency synthesis with simultaneous multiplication,division, and phase shifting

• Sixteen low-skew global clock networks

• Simplified configuration, supports low-cost standards

• 2-pin auto-detect configuration• Broad third-party SPI (up to x4) and NOR flash support

• Feature rich Xilinx Platform Flash with JTAG

• MultiBoot support for remote upgrade with multiplebitstreams, using watchdog protection

• Enhanced security for design protection

• Unique Device DNA identifier for design authentication

• AES bitstream encryption in the larger devices

• Faster embedded processing with enhanced, low cost,MicroBlaze™ soft processor

• Industry-leading IP and reference designs

Spartan-6 FPGA Feature Summary

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