Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-6501-30

14-6501-30

.6 WW SOCKET

Aries Electronics

3,715 6.32
RFQ
- 501 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6503-20

10-6503-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,505 6.32
RFQ
10-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6503-30

10-6503-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,378 6.32
RFQ
10-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-1518-11

36-1518-11

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,373 6.34
RFQ
36-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-3513-10

32-3513-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,734 6.34
RFQ
32-3513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-3513-10T

36-3513-10T

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,552 6.34
RFQ
36-3513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-00

25-0518-00

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3,355 6.37
RFQ
25-0518-00

Datasheet

Bulk 518 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-0518-11

36-0518-11

CONN SOCKET SIP 36POS GOLD

Aries Electronics

3,944 6.37
RFQ
36-0518-11

Datasheet

Bulk 518 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0508-20

13-0508-20

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,654 6.37
RFQ
13-0508-20

Datasheet

Bulk 508 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
13-0508-30

13-0508-30

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2,439 6.37
RFQ
13-0508-30

Datasheet

Bulk 508 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
06-6820-90C

06-6820-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,234 6.37
RFQ
06-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6822-90C

06-6822-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,850 6.37
RFQ
06-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6823-90C

06-6823-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,551 6.37
RFQ
06-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3501-21

08-3501-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,360 6.39
RFQ
08-3501-21

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-3501-31

08-3501-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,191 6.39
RFQ
08-3501-31

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-111

18-3518-111

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,612 6.41
RFQ
18-3518-111

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-102

20-3518-102

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,838 6.41
RFQ
20-3518-102

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6511-10

36-6511-10

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

3,358 6.41
RFQ
36-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
07-0503-21

07-0503-21

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3,317 6.46
RFQ
07-0503-21

Datasheet

Bulk 0503 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
07-0503-31

07-0503-31

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3,672 6.46
RFQ
07-0503-31

Datasheet

Bulk 0503 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
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