Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
34-7650-10

34-7650-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

2,030 17.07
RFQ
34-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-7725-10

34-7725-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

2,118 17.07
RFQ
34-7725-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-7750-10

34-7750-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

2,502 17.07
RFQ
34-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
35-7435-10

35-7435-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

2,154 17.07
RFQ
35-7435-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-0508-20

40-0508-20

CONN SOCKET SIP 40POS GOLD

Aries Electronics

2,782 17.14
RFQ
40-0508-20

Datasheet

Bulk 508 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
40-0508-30

40-0508-30

CONN SOCKET SIP 40POS GOLD

Aries Electronics

2,970 17.14
RFQ
40-0508-30

Datasheet

Bulk 508 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
52-9513-11H

52-9513-11H

CONN IC DIP SOCKET 52POS GOLD

Aries Electronics

2,683 17.16
RFQ
52-9513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6820-90C

32-6820-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,807 17.18
RFQ
32-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6822-90C

32-6822-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,508 17.18
RFQ
32-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6823-90C

32-6823-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,514 17.18
RFQ
32-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-9503-20

30-9503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,881 17.20
RFQ
30-9503-20

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9503-30

30-9503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,411 17.20
RFQ
30-9503-30

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-822-90C

32-822-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,413 17.20
RFQ
32-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-823-90C

32-823-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,832 17.20
RFQ
32-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-822-90EWR

18-822-90EWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3,606 17.24
RFQ
18-822-90EWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-6556-11

28-6556-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,605 17.26
RFQ
28-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
36-3503-20

36-3503-20

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,233 17.26
RFQ
36-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-3503-30

36-3503-30

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,348 17.26
RFQ
36-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-0503-21

21-0503-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,042 17.26
RFQ
21-0503-21

Datasheet

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
21-0503-31

21-0503-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,165 17.26
RFQ
21-0503-31

Datasheet

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
Total 4324 Record«Prev1... 127128129130131132133134...217Next»
Deyee Tech  Limited

HOME

Deyee Tech  Limited

PRODUCT

Deyee Tech  Limited

PHONE

Deyee Tech  Limited

USER